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Industrial Production of Microholes by Usage of Ultrashort Pulse Lasers

Fig. 1
Fig. 1

Thomas Höche, Jens Hänel und Markus Lasch

 

The drilling of microholes with well-defined geometry is becoming increasingly important in various branches of industry. Applications range from injection nozzles (automotive) over cooling openings in turbine stator vanes (aerospace) and emitter-wrap through perforations (solar) to spinnerets required to adopt more and more complex shapes for the fabrication of functional fibres (textile industry).

 

Besides electric discharge machining, being very successfully applied in many branches, laser processes are scrutinized and optimized for microhole fabrication due to its inherent, enormous flexibility for many years. It turned out that many parameters must be very precisely controlled in order to enable the generation of holes of just several 10 µm diameter in materials of a few millimetre thickness. For example, copper-vapour lasers, the beam profile of which can be optimized very well to comply with a flat-top profile, can be deployed for the fabrication of holes possessing very good circularity and directrix quality. The manifold capabilities of laser micromachining, however, are not fully capitalized when just stationary laser beams are used (as in the case of percussion drilling).

 

In the current perspective, the greatest flexibility can be achieved by using the technically very sophisticated concept of drilling with a moved laser beam. Under the latter technology, trepanning as well as helical drilling are subsumed. Upon trepanning, the laser beam is moved along the surface of a cone with customizable opening angle and is in parallel accomplishing a circular movement with defined diameter on the surface of the work piece. Helical drilling distinguishes itself by the fact that in addition to the toggling movement of the laser the laser beam is rotating about its axis of propagation. The latter feature helps eliminate imperfections of the beam profile and provides the capability of drilling holes at highest perfection. Helical drilling requires the utilisation of high-definition drilling heads, the core component of which is a hollow-shaft motor bearing an image rotator, e.g., a Dove prism, as well as adjustment modules for adapting the angle of laser impact and the diameter of the circle scribed on the work piece.

 

Now that all of these key components can be addressed from the proprietary controls software microMMI, developed by and implemented on all laser micromachining workstations of 3D-Micromac, highly precise micro holes can be machined. Micro bores of just a few 10 µm diameter can be drilled with precisely controllable taper. As an example, in 1 mm thick stainless steel, microholes can be drilled from just one side either with an entrance opening diameter of De = 70 μm and an exit-side opening diameter Da = 140 μm (undercut, Fig. 1), or vice versa, e.g. De = 140 μm versus Da = 70 μm. Every intermediate combination of entrance and exit hole diameter one might think of is feasible, among the latter also exactly cylindrical holes. Deviations from circularity in the order of a few micrometers can be attained on a routine basis. Remarkably, helical drilling is only suitable for thicknesses ranging from a few 100 µm to about 2 mm. This is related to the fact that helical drilling of microholes is not a classical laser-ablation process strictly covered by the rules of ray optics, but rather more resembles a plasma etching process which is excited by the localized application of the laser. Looked at it this way, for too thin material, the erosion plasma does not yet evolve properly while for too thick sheets, the required energy cannot be transferred towards the bottom of the hole.

Fig. 2
Fig. 2

Besides beam shaping and beam guidance, the utilisation of lasers for materials micro machining offers further capabilities of parameter variation. For examples, the question might be posed at which wavelength and/or pulse duration optimum machining can be achieved. At the moment, much attention is paid towards the usage of green solid-state lasers. Lasers emitting at 532 nm wavelength, however, are available at various pulse lengths. In completion of Nd:YAG short-pulse lasers (pulse lengths in the microsecond and nanosecond range), ultrashort pulsed laser (pulse duration between femtoseconds and picoseconds) are advantageous in many aspects. For many applications of microdrilling, the extent of the heat-affected zone, HAZ, is a very important criterion. The HAZ is as large as a few microns for short-pulsed laser, but amounts just a few 100 nm for picosecond lasers and even less than 100 nm for femtosecond lasers [1].


The development of lasers that meet industries demands has advanced significantly over the past five years and form today’s perspective, it can be stated that picosecond lasers operated in the infrared at a few 10 W output power and more are available and micromachining at sufficiently high repetition rates is possible even after frequency doubling. Extensive series of experiments have proven that at a wavelength of 532 nm picosecond laser micromachining in combination with a helical drilling head is particularly promising for industrial applications (Fig. 2). Besides the very limited extent of the HAZ, the following advantages became obvious:

  1. The significantly reduced pulse length (in comparison to short-pulse laser machining) lead the suppression of plasma shielding, hence greatly enhancing the quality of the entrance openings of microholes.
  2. Based on multiphoton absorption, ultrashort pulsed lasers can be used to machine materials that a transparent at the laser wavelength, such as glasses.
Fig. 3
Fig. 3

Helical drilling using ultrashort pulses is a very promising technology capable of drilling microholes at highest precision into relatively thick workpieces (typical thickness between 500 µm and 1 mm) made of many different materials including stainless steel, molybdenum (cf. Fig. 3), float glass, as well as graphite.


A highly sophisticated control of the drilling process provided, further industrial applications can be pursued. Using the helical drilling head, microcuts possessing variable cutting-crack angles can be generated [2]. Along a pre-defined trajectory, the work piece is cut by a relative motion between the sample and the laser beam being conditioned by the helical drilling head. A certain cutting-crack angle is assigned to each point of the trajectory by an adequate alignment of laser impingement angle of the laser and focus setting.

 

It is already now becoming apparent that micromachining utilizing the combination of helical drilling and ultrashort pulses is going to become an integral part of industrial laser application.


References

[1] Th. Höche, D. Ruthe, and T. Petsch: „Femtosecond-Laser Interaction with Mo/Si Multilayer Stack at Low Fluence", Appl. Phys. A, 79[4-6] (2004) 961.

[2] Th. Höche, B. Keiper, T. Petsch, and M. Lasch: "Verfahren und Vorrichtung zum Laserschneiden", Patent application, Deutsches Patent und Markenamt, regis tration number: 10 2008 000306.9, filed