microSTRUCT C

3D-Micromac presents new design line

Flexibility meets design

Just in time for LASER World of Photonics 2011, 3D-Micromac AG is presenting its all new design concept that is applied to the microSTRUCT C laser system for the first time. The company's new design line stands for modernity, flexibility and uniqueness. The goal of the new design development was the creation of uniform design features that can be adapted to future 3D-Micromac products.

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microSTRUCT Machining Area
microSTRUCT Machining Area

3D-Micromac AG presents picosecond laser system microSTRUCT C

Gently processing by use of ultra short pulse lasers

Caused by a progressing trend to miniaturization in electronics, semi-conductor production and medical engineering it is compulsory necessary to reach continually smaller and more particularized structures in various substrates. Traditional production technologies reach their limits. The processing by ultra short pulse lasers offers best conditions for the required quality and precision due to an almost athermal ablation. Therefore, 3D-Micromac AG developed a compact, modular constructed system for processing with ultra short pulse lasers in order to fit these requirements and successfully placed it on the market. In addition to an individual design of this system, 3D-Micromac focused on high quality, precision, reliability and flexibility.

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Processing of thin-film materials by use of reel to reel laser processing

The development in the area of electronics and photovoltaics has been tending to more and more reliability, less weight, cheaper production and flexibility over the last years. Result of this development is a steady growing demand by the industry for thin-film processing systems. Those systems have to ensure high efficiency rates and big process areas. In order to fulfill these requirements, 3D-Micromac developed the laser micromachining system microFLEX for ablation of thin films on flexible substrates. This system works in a reel-to-reel process and thus it is able to reduce the effort for the production of devices.

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