microDRILLTM
Increasingly, semiconductor wafers and metals in the fabrication of MEMS are being drilled and cut by enhanced laser machining systems. Highest quality at highest processing speeds is considerable benefit for your production. The microDRILLTM of 3D-Micromac AG is a perfectly versatile tool for this application. The microDRILLTM combines the required characteristics with the unbeatable performance of diode pumped solid state lasers and is suited for high throughput industrial applications and smooth machining.
microDRILLTM contains a license of the control software microMMI with the following features:
microDRILLTM contains a license of the control software microMMI with the following features:
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Multilingual software based on English
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Full worldwide remote access via network
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Customized log file to store all commands, processes and laser parameter
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Separate modes for operators, supervisors and service
DPSS laser source
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1064 nm, 532 nm (SHG)355 nm (THG), 266 nm (FHG)
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Repetition rate 1 kHz to 100 kHz
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Beam profile TEM00
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Energy 100 µJ to 15 mJ
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Average power 0.5 to 20 W
Options
- Semi automated or fully automated alignment with camera system
- Automated work piece handling
- Vacuum chuck
- Mount for 300 mm wafer
- Customer specific work piece mounts
- Fully air conditioned processing chamber
- Mini environment up to ISO class 4
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Beam analysis with microPROFILERTM software

Deutsch
English
USA


