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microSIGN
In the past, marking of wafers of various semi conducting material, DIEs, and MEMS in ultimate quality was the domain of large, expensive facilities.
With the system microSIGN 3D-Micromac presents a solution possessing the characteristics of much larger systems already for smaller lots. microSIGN is the first choice where hard and soft marking on semiconductors are about. Today, our microSIGN can be easily customized for large automized production as well as for a small production.
With the system microSIGN 3D-Micromac presents a solution possessing the characteristics of much larger systems already for smaller lots. microSIGN is the first choice where hard and soft marking on semiconductors are about. Today, our microSIGN can be easily customized for large automized production as well as for a small production.
Whenever hard or soft marking complying with SEMI standards or customer specifications is required, a microSIGN is your first choice. The control of the workstation will be done by an IPC and the control software microMMI with the following features:
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Multilingual software based on English
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Full worldwide remote access via network
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Customized log file to store all commands, processes and laser parameter
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Separate modes for operators, supervisors and service
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Programming in Visual Basic Script or via data import
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Interfaces GDS II, STL, DXF
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Addressing of up to 32 NC axes
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Intuitive graphical operator interface with preview
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Marking with single or double density codes complying
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SEMI standards M12, M13 or according to customers definition
Laser source
- DPSS laser source
- 1064 nm, 532 nm (SHG)
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Semi-automated or fully automated alignment with camera system
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Automated workpiece handling
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Vacuum chuck
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Workpieces mount for 300 mm wafer
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Purpose build mounts for masks
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Customer-specific workpiece mounts
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Fully air-conditioned processing chamber
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Mini environment up to ISO class 4
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Beam analyser featuring microPROFILER software