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microSPIN

Machining of thin film materials with Roll-to-Roll laser system

The trend of development in recent years for electronic or photovoltaic devices is: “Make it more reliable, make it more light-weight, make it cheaper, make it more flexible!” One result of this fact is that there is a steady growing demand in the industry for thin film processing systems. To reach the aforementioned goals these systems must provide some essential functionality as higher throughput or larger machining areas.


The new microSPIN is a laser micromachining system for thin film materials handled with an integrated Roll-to-Roll transportation system.

With its high speed picture recognition system it is possible to make laser micromachining at a roll speed up to 2,8 m/s in real time.

Another proof of the flexibility of the microSPIN system is universal handling for every kind of material. The system is able to process plastic materials, thin film layer substrates or even change it in-between also with different material thicknesses.


Features

  • Online focus recalibration
  • Integration of different kinds of laser sources due to customers demands
  • Options like online QS system with high speed cameras
Static Parameters

Material thickness: PET ≥ 50 μm; Paper ≥ 100 μm
Internal roll diameter: 76 mm
External roll diameter: max. 500 mm
Roll width: up to 600 mm
Roll weight: max. 100 kg

Dynamic Parameters

Tractive force: 20 - 700 N
Edge guide: ± 0,1 mm
Velocity: max 170 m/min
Velocity tolerance: ± 3 %
Adjustable winding trait  

Image and mark recognition

Velocity with mark recognition: 20 - 60 m/min
Incident and transmitted
illumination:
For transparent and
opaque materials
Camera resolution: 20 μm/Pixel; 5 μm/Pixel